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Litton GC/S |
| From [log in to unmask] Wed Jan 31 10: |
43:32 1996 |
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We are the design agent and user of printed circuit boards. Just recently
one of our board suppliers requested a material change
from: Rolled & Annealed Copper {IPC-MF-150, GR 7} on both sides of
0.031" FR-4 Laminate.
to: Electrodeposited Copper {IPC-MF-150, GR 1} on both sides of 0.031"
FR-4 Laminate.
OR
Electrodeposited HTE Copper {IPC-MF-150, GR 3} on both sides of 0.031"
FR-4 Laminate.
My question is which of the above material configurations is the most
available and the most cost efficient.
Thank You One And All
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