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-- [ From: Doug Jeffery * EMC.Ver #2.10P ] --
Wendell,
We do thermal shock/stress only after etch. As this is the best time
to see the totatl effects of Z axis movement. At pattern plate you
would not see the full impact of the test as the outer foils are still
full sheets and will create a different effect. We use a std. 550
Degree F for 10 sec. both conditioned and not conditioned.
At pattern plate we pull sections for thickness, uniformity, and
interconnect examination.
Doug Jeffery
Electrotek,
-------- REPLY, Original message follows --------
> Date: Wednesday, 08-May-96 09:02 PM
>
> From: [log in to unmask] \ Internet: ([log in to unmask])
> To: Doug Jeffery \ PRODIGY: (TCGE34A)
>
> Subject: In-process Test coupons
>
> Does anybody pull coupons immediately after pattern plate and solder
float
> the coupons as an inprocess check? If so how many floats and at what
> temperature: the usual 550F? If mutiple floats are used what reject
> criteria is used?
>
>
>
-------- REPLY, End of original message --------
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