-- [ From: Doug Jeffery * EMC.Ver #2.10P ] -- Wendell, We do thermal shock/stress only after etch. As this is the best time to see the totatl effects of Z axis movement. At pattern plate you would not see the full impact of the test as the outer foils are still full sheets and will create a different effect. We use a std. 550 Degree F for 10 sec. both conditioned and not conditioned. At pattern plate we pull sections for thickness, uniformity, and interconnect examination. Doug Jeffery Electrotek, -------- REPLY, Original message follows -------- > Date: Wednesday, 08-May-96 09:02 PM > > From: [log in to unmask] \ Internet: ([log in to unmask]) > To: Doug Jeffery \ PRODIGY: (TCGE34A) > > Subject: In-process Test coupons > > Does anybody pull coupons immediately after pattern plate and solder float > the coupons as an inprocess check? If so how many floats and at what > temperature: the usual 550F? If mutiple floats are used what reject > criteria is used? > > > -------- REPLY, End of original message --------