-- [ From: Doug Jeffery * EMC.Ver #2.10P ] --


Wendell,

We do thermal shock/stress only after etch.   As this is the best time
to see the totatl effects of Z axis movement.  At pattern plate you
would not see the full impact of the test as the outer foils are still
full sheets and will create a different effect.  We use a std. 550
Degree F for 10 sec. both conditioned and not conditioned.

At pattern plate we pull sections for thickness, uniformity, and
interconnect examination.


Doug Jeffery
Electrotek,

-------- REPLY, Original message follows --------

> Date: Wednesday, 08-May-96 09:02 PM
> 
> From: [log in to unmask]       \ Internet:    ([log in to unmask])
> To:   Doug Jeffery             \ PRODIGY:     (TCGE34A)
> 
> Subject: In-process Test coupons
> 
> Does anybody pull coupons immediately after pattern plate and solder
float
> the coupons as an inprocess check?  If so how many floats and at what
> temperature: the usual 550F?  If mutiple floats are used what reject
> criteria is used?
> 
> 
> 

-------- REPLY, End of original message --------