Forgive the late response to this message. I believe that there have been 
sufficient response regarding the 1210 (sect, 8.2); However, the MELF 
problem can be explained in one word "TYPO". The "Z max" dimensions were 
repeated in the "X max" column; will be corrected in SM-782 ammendment and 
the next revision. 

I have pulled up the EM-782 spreadsheets, where the correct dimensions 
can be found. The following are the dimensions for Section 8.5 MELF 
"X max" with associated RLP NO.:

	RLP 200		1.80 mm
	RLP 201		2.60 mm
	RLP 202		1.60 mm
	RLP 203		2.00 mm
	RLP 204		1.80 mm
	RLP 205		2.60 mm

Regards, Vivian Vosburg,  Electronics Manufacturing Extension Center at IPC
			  (708)509-9700  X377

		========================================

	
On Fri, 27 Oct 1995, KEVIN BERRY wrote:

>  To All:
> 
>   Recently when building a 1210 footprint for our CAD design software per
> IPC-SM-782 (subsection 8.2), we noticed that the recommended land dimensions
> for 1210 chip capacitors are smaller than the actual width of the component
> and terminal area of part. We also noticed that it is the same for case sizes
> 1812 and 1825 but not for case sizes lower than 1210.
> 
>  Secondly, We are also curious about the melf package SOD-87/MLL41 footprint
> (subsection 8.5). The recommended footprint is huge compared to the actual
> melf component.
> 
>   If anyone can tell me if these recommended footprint dimensions are
> correct/incorrect and why they are as such please respond.
> 
>   thanks,
> 
> Kevin Berry
> Geco-Prakla, Schlumberger
> 10420 Miller Rd.
> Dallas, Tx. 75238
> [log in to unmask]
> 
>