TECHNET Archives

1995

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Copy of: Solder Resist Cure Test
From:
Robert Willis <[log in to unmask]>
Date:
04 Jun 95 13:22:01 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 

---------- Forwarded Message ----------

From:	Robert Willis, 100537,2615
TO:	IPC, InterNet:[log in to unmask]
DATE:	20/05/95 15:48

RE:	Copy of: Solder Resist Cure Test

Does any one know a test for measuring the degree of cure for solder resists
that works and provides a useful measurement. I do not have any method apart
form the IPC, BS or IEC methods which are not very good as most people in the
circuit industry know.
I am trying to use DSC at the pressent with limited luck.
Bob Willis
VP SMART Group
Tel:  44 1245 351502
Fax: 44 1245 496123

ATOM RSS1 RSS2