Subject: | |
From: | |
Date: | Tue, 05 Dec 95 08:51:00 EST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Following from the EMPF HelpLine, prepared by Jeff Kukelhan:
There are two types of gold coatings available: electrolytic and
electroless.
Electrolytic is usually thicker (50 to 100 microinches). It is often used
for
mechanical contacts (edge connectors), although I have seen electrolytic
gold
used for solderable surfaces.
The more common finish for solderable surface mount boards is immersion (or
electroless) gold. The copper pads are first plated with about 50
microinches of
Ni. When immersed in the Au bath, some of the Ni enters solution and
reduces the
Au. The Au precipitates out on the Ni surface. The process is self
limiting because
eventually all of the Ni is covered with Au. When there is no Ni left to go
into solution,
no more Au will percipitate. The resulting Au coating is about 5 to 15
microinches
thick. The amount of Au covering the pads is so small that when covered
with a
nominal amount of solder paste it will not embrittle the resulting joint. I
have copies
of two articles printed within the last two years that deal with immersion
Au coated
boards, and how to avoid joint embrittlement. If you are interested in
obtaining
copies, contact the EMPF HelpLine at 317.226.5616 or
[log in to unmask] (alt short address
[log in to unmask])
----------
From: TechNet-request
To: TechNet
Subject: Gold Flash Coating
Date: 4 Dec 95 2:29PM
Return-Path: <[log in to unmask]>
Resent-Date: Mon, 4 Dec 1995 15:37:54 -0500
Old-Return-Path: <miso!grci.com!lbrown>
Date: Mon, 4 Dec 95 14:29:57 PST
From: Len Brown <[log in to unmask]>
Sender: Len Brown <[log in to unmask]>
Subject: Gold Flash Coating
To: [log in to unmask]
X-Mailer: Chameleon - TCP/IP for Windows by NetManage, Inc.
Message-Id: <[log in to unmask]>
Mime-Version: 1.0
Content-Type: TEXT/PLAIN; charset=US-ASCII
Resent-Message-ID: <"ZYfRw1.0.w2D._tqmm"@ipc>
Resent-From: [log in to unmask]
X-Mailing-List: <[log in to unmask]> archive/latest/1970
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]
----------------------------------------------------------------------------
--
I am looking for information conserning gold flash on pc boards.
Pros
& cons of gold.
1) Does it create a better surface for fine pitch surface
mount parts?
2) Is there any possibility of embrittlement of solder
joints?
Any information will be appreciated Thanks in advance.
*************************************************************************
* *
* Len Brown GRC International, Inc. *
* [log in to unmask] 8310 Guilford Road, Suite A *
* 410-290-7111 x240 Columbia, MD 21046 *
* fax 410-290-7122 *
* Date: 12/04/95 Time: 14:29:57 *
*************************************************************************
|
|
|