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Sun, 27 Aug 95 00:24:26 EDT
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FROM: BRUCE HOUGHTON  27/552/844/TOR                                           
Phone  (416) 448-5701     Tie 778-5701                                         
Subject: Surface Solderability Test                                            
Jim,                                                                           
Re your note on Aug 15, the test may be interesting but not all                
encompassing.  With OSP finishes, the solder paste does not flow               
out across the copper and knowing that, we can select the stencil              
aperture size and thickness and get the desired solder joint without           
worrying about the solder 'running away' on the pad, especially                
if there is an adjacent via.  I think the test will only be                    
applicable on metallic and maybe just HASL finishes.                           
                                                                               
Bruce Houghton                                                                 
Staff Engineer, Celestica, Inc.                                                
Internet:  [log in to unmask]                                              
*** Forwarding note from SMTP2   --IINUS1   08/15/95 17:46 ***

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