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Date: | Sun, 20 Aug 95 21:35:12 CST |
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Some grades of organic coatings can only survive one IR reflow.
This means that after the first heat excursion the
protective coat is gone and copper oxidation begins. You
need to use a grade that is designed to handle multiple heat
excursions. The problem with your boards right now is that
they are obviously now oxidized. The post SMT clean
operation and any baking you did will have contributed to
this. I'm not sure of any fluxes that could wet such an
oxidized surface. I don't know if you will be able to use
these boards, without damaging your SMT. Recoating the
boards involves among other things a microetch to clean the
oxidation off of the copper. If possible you might try to
remove the SMT from the boards, recoat, then do SMT, then
immediately to your manual soldering. Very risky though,
multiple recoatings of OPCs can overetch your plated
through holes or do some other bad stuff to the surface of
the board. Talk to your bare board house that provided the
boards. I hate to say it, you might be better off salvaging
what SMT you can, get new boards (with either a better ODP,
or HASL), and restuffing.
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We are having trouble soldering organic protective coated bare copper
boards. The difficulty is occurring with manual iron soldering in the
post wave/wash shop.
The boards soldered fine in SMT, and then they were washed. They then
sat several weeks awaiting finalization of engineering changes and
receipt of the EC parts. Now we are having extreme difficulty getting
the solder to wet to the copper in the postmount shop.
Does anyone have suggestions to overcome this problem? Would it be
feasible to recoat the bare copper when it's determined the boards
cannot be completed immediately? Does anyone have a suggested time
limit in which to complete soldering after the wash? Does anyone know
of aggressive flux cored solder wire which can promote wetting and
still meet Bellcore specifications?
Any advice would be appreciated.
Allen Ahlert
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