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1995

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Subject:
From:
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc>
Date:
Mon, 24 Jul 95 15:14:01 -0400
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         I'm currently working on a research project to develop the 
         technology for including BGAs in our designs.  The project will 
         include board design, solder joint volume, FEA, thermal 
         analysis, process optimization and rework and repair.  The 
         assemblies will be ceramic BGAs soldered to polyimide 
         multilayer boards which will be hard bonded to a restraining 
         core made of silicon carbide/aluminum metal matrix.
         
         My management is concerned that one of our customers, the Navy, 
         will be reluctant to allow the use of BGA technology on their 
         hardware, considering the difficulty we had in convincing them 
         to go surface mount.
         
         I'm looking for a list of other electronics manufacturers who 
         are using BGAs on military contracts.  If anyone is presently 
         doing so, please let me know.
         
         Thanks in advance, 
         
         Jim Marsico 
         AIL Systems, Inc.
         Deer Park, NY
         [log in to unmask]
         or 516-595-5879.
         
         Thanks 



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