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1995

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Subject:
Re: Solder Balls and Solder Mask
From:
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To: MR DOUGLAS C JEFFERY <[log in to unmask]>
Cc: [log in to unmask]
Subject: Re: Tin/lead plating vs HAL [...]39_Pine.3.89.9506211229.E46751-0100000@ipc0_0_
Date:
Mon, 18 Dec 1995 19:52:07 -0500
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Suggest you see latest (December 95) issue of PC Fab, there is an article
that  discusses the effect of different fillers in the solder mask on solder
balls.

Rudy Sedlak

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