TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask][log in to unmask] Jun 95 13:22:01 EDT606_- ---------- Forwarded Message ----------

From: Robert Willis, 100537,2615
TO: IPC, InterNet:[log in to unmask]
DATE: 20/05/95 15:48

RE: Copy of: Solder Resist Cure Test

Does any one know a test for measuring the degree of cure for solder resists
that works and provides a useful measurement. I do not have any method apart
form the IPC, BS or IEC methods which are not very good as most people in the
circuit industry know.
I am trying to use DSC at the pressent with limited luck.
Bob Willis
VP SMART Group
Tel: 44 1245 351502
Fax: 44 1245 [log in to unmask]
Date:
Sat, 2 Dec 1995 10:51:04 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
In a message dated 95-11-28 21:12:48 EST, Cb5757 writes:

<< 
We would like to buy new, used, or even damaged depanelizing shear.  Series
540 Cencorp (Dover Technologies) 24 inch version desired or equivalent type
of equipment.  Ready to buy NOW.

contact me at [log in to unmask] right away.  C. Byxbee >>
or call me at (208) 756-8000  x1313


---------------------
Forwarded message:
Subj:    Cencorp 540 PCB Depaneling Shear Wanted ! !
Date:    95-11-28 21:12:48 EST
From:    Cb5757
To:      [log in to unmask]

We would like to buy new, used, or even damaged shear.  Series 540 Cencorp
(Dover Technologies) 24 inch version desired or equivalent type of equipment.
 Ready to buy NOW.

contact me at [log in to unmask] right away.  C. Byxbee



ATOM RSS1 RSS2