1. When wavesoldering with no-clean flux and nitrogen, solder balls seem 
to be a common problem.  While solder mask is part of the problem I have 
found that the lead length of connectors, sip's and other inline 
componets have the greatest effect on solder ball production.  By 
cutting the leads to .080-.085  from the standard length of .110-.120
we can eliminate the solder balls. The problem is that you can not buy 
connectors and other components at the storter lead length.  The 
manufactures claim no one is asking for shorter leads.  I have not been 
able to find any documentation that backs up my claim. If you have the 
same requirement or have a article about lead length and solder balls 
please let me hear from you.


2. IPC. Do you know about this?  Have you done any testing?  I believe 
that we need a lead length spec for the no-clean process.  Electrovert 
knows that this is a problem and so do most of the people I have talked 
with at the major flux companies. Can IPC help?