TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (JOHN GULLEY)
Date:
Mon, 20 Nov 1995 10:11:00 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
     Address,
     
     Can anyone supply technical laymen information on Speed Ball and 
     Polyimide Laminates.  I would also appreciate any test data (e.g. 
     thermal, humidity, solder, tensile strength tests) that have been 
     performed to prove the long reliability of these materials.  A 
     material characteristics sheet is also helpful.  Thank you.
     
     John Gulley - PCB Project Coordinator
     Hitachi Computer Products Division
     1800 East Imhoff Rd
     Norman, OK 73071
     
     [log in to unmask]
     405-360-5500 x634



ATOM RSS1 RSS2