At the ISHM conference in LA, a number of manufacturers supporting the 
flip chipp process were exibiting.  Bump distribution, sealing the chip
with a vacume (to get sealant "pulled" under the chip) were presented.

At our "Emerging Technologies" meeting, back in 94, a manufacturer who
"bumps" wafers made a presentation.

I am afraid that this info _isn't_ at the local grocery store, but 
it is out their.

J. Fjelstad commented:
....It would seem to me that it would be in the best interests of
these folks to fill the airways with information about the nature of their
stucture and its relaibility............

Bill Gaines
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Bill Gaines
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