Richard,

I'd like more info on how passive components are more subject to damage by
wave soldering that active ones.  We are working on a new PCB design and
recently eliminated all active components from the back of it.  It now has
only caps.  How much of a production problem might this represent?  What
failure rates have you seen on passives?

>I have been running the wave soldering courses for Electrovert for 8 years, I
>have worked in sub contract manufcatre for two years and before that 15
years in
>a major OEM. Wave soldering of SOIC devices is not a problem. There has
been far
>more problems with SOT23 and pasive components.
>
>Soldering QFP devices may need some baking prior to wave soldering.
Provided you
>evaluate the comoponents prior to use, test there process compatability it is
>not a problem.
>
>There are hundreds of users wave soldering SOIC devices, not always well but
>that is another issue. During workshops on soldering I conducted 5 years ago in
>your country many of the assembly plants were running SOIC devices through the
>wave,
>
>Bob Willis
>Tel 01245 351502
>Fax 01245 496123
>
>
>
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| Tom Crofford
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| 918-664-6876 fax
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