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1995

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Subject:
Plating specification
From:
David Hamilton <[log in to unmask]>
Date:
Thu, 19 Oct 1995 11:54:42 -0500
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     There are plating specifications and test methods for gold over nickel
plating on printed circuit board edge connectors. Verifying plating
thickness is straight forward but what pass/fail criteria are used in the
industry for porosity of gold over nickel? How many pores per CM*CM are allowed?
     Any sources of information/specifications would be appreciated.
 =====================================================================
*  David Hamilton               Ph:    334-283-7377
*  Manager of Electronics       FAX:   334-283-7293
*  Schlumberger Water Division  Email: [log in to unmask] 
*  Hwy 229 South 
*  Tallassee, Al. 36078
 =====================================================================

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