TECHNET Archives

1995

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Solder splashes.
From:
[log in to unmask]
Date:
Thu, 19 Oct 95 11:29:19 CST
Content-Type:
text/plain
Parts/Attachments:
text/plain (12 lines) 
     
     We are looking for help in evaluating the impact on contact 
     reliability caused by solder splashes on gold plated fingers.  I have 
     been told that the splashes are approximately .001" in diameter and 
     probably were deposited on the boards during rework.
     
     Thank you for any suggestions.
     Myron Papiz
     MSL

ATOM RSS1 RSS2