Thermal Cycling
I want to perform a non-destructive thermal cycling / thermal shock test on
finished SMD PCAs (commercial/industrial computer peripherial add-on PCAs) that
will: 

    a)  sufficiently stress weak solder joints to failure, so that they can be
detected at electrical test of the PCA  AND
    b)  not damage any of the installed components, thus inducing further
reliability problems into the equation.

I have access to an ESS chamber with a maximum temperature ramp rate of 18
degrees C per min.  The operating temperature for the PCA os 0-70 degrees C.

What is the most effective ramp rate, soak time and number of cycles to
accomplish the above objectives?  Other than power cycling or biased burn-in,
are there any other equally effective techniques to achieve the same end
result?

Thanks in advance for your input.

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Bill Fabry, Process & QA Mgr.
Truevision, Inc.
2500 Walsh Avenue
Santa Clara, Ca. 95051
(408) 562-4200 x366 (phone)
(408) 562-4067 (FAX)
e-mail:  [log in to unmask]
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