From: Jeff Worth - New Products Engineering	
      IBM PC Company
      Austin, Texas 78758
      (512) 838-5374
Dale,

It may be that the pads are not cleaned very well after HASL. Is there any
pattern or is it random? A pattern may indicate a cleaning problem, which 
might lead to a thin residue of flux being left on certain areas of the 
panel.
You, also may want to do a cross section on a few panels to see whats going
on with the intermetallics.

---------- Forwarded message ----------
Date: Mon, 24 Apr 95 15:35:49 MST
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Subject: No clean process impacts

I have a question with regards to the no clean process: If I have a PCB .062" 
thick with SMT pads that have been processed through the Hot Air Solder Level 
process and the solder thickness readings are at 100f"or above; using a non-
activated flux, specifically, Rosin flux 25% water, 75% isopropyl alcohol. Why 
do some pads during a solderability test wet and other pads directly next to it 
do not? Any feedback on this would be appreciated.

Thanks,
Dale Panzero