From: Jeff Worth - New Products Engineering IBM PC Company Austin, Texas 78758 (512) 838-5374 Dale, It may be that the pads are not cleaned very well after HASL. Is there any pattern or is it random? A pattern may indicate a cleaning problem, which might lead to a thin residue of flux being left on certain areas of the panel. You, also may want to do a cross section on a few panels to see whats going on with the intermetallics. ---------- Forwarded message ---------- Date: Mon, 24 Apr 95 15:35:49 MST From:[log in to unmask] To: [log in to unmask] Subject: No clean process impacts I have a question with regards to the no clean process: If I have a PCB .062" thick with SMT pads that have been processed through the Hot Air Solder Level process and the solder thickness readings are at 100f"or above; using a non- activated flux, specifically, Rosin flux 25% water, 75% isopropyl alcohol. Why do some pads during a solderability test wet and other pads directly next to it do not? Any feedback on this would be appreciated. Thanks, Dale Panzero