I would suggest that the variability in solder thickness that Etidwell
reported is likely the normal variation that comes with hot air solder 
leveling.  

Therein lies the reason the most of the SMT industry is seeking alternative 
processes such as Electroless Nickel/Immersion Gold, Electroless Palladium, 
CU-56 coatings and the like in a grand effort to seek "planarity".

My employer, by the way, is happy to quote product with any of the above 
surface finishes.

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