We have been wave soldering SOIC and SOJ packages for quite some 
     time, but recently we are finding solder balls flattened like pancakes 
     underneath these devices after wave solder. The package stand-offs are 
     the standard 8-10 mils for the SOICs and 25-26 mils for the SOJs and 
     we have not been able to identify any process or material changes that 
     may be causing this phenomenon.
     
        Has anyone had a similar experience and found the cause for this 
     defect? Any help would be much appreciated.
     
     Ray Turner
     Cabletron Systems