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1995

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Subject:
Thermal Relief Design
From:
[log in to unmask] (Pat McGuine)
Date:
Mon, 31 Jul 1995 10:31:49 -0500
Content-Type:
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Designing thermals on power and ground planes:

I've heard that rule-of-thumb is an ID of 0.015" over the hole size, and an
OD of 0.020" over the ID.

Questions:
1.  Does IPC have a spec for thermal relief?
2.  Do the rules change as the hole size changes?

Thanks in advance.


-Pat-

-------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334

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