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From: Jeff Worth - New Products Engineering
IBM PC Company
Austin, Texas 78758
(512) 838-5374
Dale,
It may be that the pads are not cleaned very well after HASL. Is there any
pattern or is it random? A pattern may indicate a cleaning problem, which
might lead to a thin residue of flux being left on certain areas of the
panel.
You, also may want to do a cross section on a few panels to see whats going
on with the intermetallics.
---------- Forwarded message ----------
Date: Mon, 24 Apr 95 15:35:49 MST
From:[log in to unmask]
To: [log in to unmask]
Subject: No clean process impacts
I have a question with regards to the no clean process: If I have a PCB .062"
thick with SMT pads that have been processed through the Hot Air Solder Level
process and the solder thickness readings are at 100f"or above; using a non-
activated flux, specifically, Rosin flux 25% water, 75% isopropyl alcohol. Why
do some pads during a solderability test wet and other pads directly next to it
do not? Any feedback on this would be appreciated.
Thanks,
Dale Panzero
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