Subject: | |
From: | |
Date: | Tue, 5 Dec 1995 22:50:21 -0500 (EST) |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
With regards to lifted pads, our experience is that the removal of non
functional pads dramatically increases the likelyhood of this problem. I
would recommend a review of the design and see whether non functional
internal lands can be added to reduce lifted lands.
Question : do lifted lands actually cause a functional problem ???
Dave Rooke
Circo Craft - Pointe Claire Quebec Canada
Phone : 514-694-8400
FAX : 514-694-2696
>______________________________ Reply Separator
_________________________________
>Subject: High Z Axis Expansion Board Materials
>Author: [log in to unmask] at SMTPLINK-HADCO
>Date: 12/2/95 5:27 PM
>
>
>We receive questions about plating high Z axis expansion board materials.
> When the expansion from assembly soldering is too great, surface pads around
>the holes lift, or the plated barrel cracks. Does anyone have a standard
>practice to prevent these phenomena when using laminate with great amounts of
> Z axis expansion (we think more than 6%)?
>
>Thicker plating in the hole?
>Alternate metals plated?
>
>Dennis Fritz
>MacDermid, Inc.
>245 Freight Street
>Waterbury CT 06702
>Phone 203-575-5740
>
>
>
>
>
|
|
|