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Date: | Wed, 22 Nov 95 12:13:31 |
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In the Nov '95 issue of "SMT", pp.26-29, Ray P. Prasad wrote:
"The critical surface finish requirement for boards is to ensure
sufficient solder thickness. The general recommendation in the industry
about maintaining at least 0.0003" (300 microinches) is essential for
long-term solderability..."
He goes on to talk about the dewetting effects of <0.0003" thick coatings
and the benefits of 5um of tin and 7.5um of 60 Sn/40 Pb.
He also deduces from a round-robin test conducted by the IPC that coating
thickness alone is not all thats important, but also the quality of the
coating.
Ray P. Prasad is a "SMT" editorial advisory board member, engineer, author
of "Surface Mount Technology: Principles and Practice", and founder of the
Ray Prasad Consultancy Group. Contact him c/o "SMT" or (503)297-5898;
fax:(503)297-0330.
Understand, I am not suggesting that you call him. This is just the
blurb from "SMT". (So much for the disclaimer -- I'm probably taking a
big enough risk just quoting him...)
I DO suggest getting "SMT" magazine.
DonW...
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