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From: | "Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
Date: | Tue, 12 Sep 95 12:29:01 -0400 |
Content-Type: | text/plain |
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Could anyone explain in layman's terms the C4 (controlled collapse chip
connection) method of die attachment? I'm trying to get a better
understanding of the process, alloy, etc. Also, when is this method
preferred over wire bonding?
Thanks in advance,
Jim Marsico
AIL Systems, Inc.
Deer Park, NY
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