Tom,
We have been using "paste in hole" for soldering connector to the
"back" side of daughter boards. It took some time for us to develop
the process which included selecting the right solder paste, stencil
configuration, lead to hole ratios, and reflow profiles that would
give us acceptable results. We are using assembly/soldering pallets
with cavities that hold the connectors in position allowing us to
pre-load the connectors in the pallets and place the pasted PWB onto
the connector pins. The pallets hold multiple boards and they are used
in the pick and place machine as well as reflow. We are also using
"paste in hole" for soldering DIP relays and we're obtaining excellent
results. I caution you to look closely at the ability of your
components to withstand the reflow temperatures, as we had to change
our connectors to a higher temperature rated material.
There is a excellent article in the January issue of the SMT
Journal that was written by Bill Barthel. I recommend that you get a
copy as it does cover the subject well.
We are in the process of expanding this methodology to other PIH
components, and we're obtaining very encouraging results.
DAN BOTTS
HUGHES TRAINING LINK DIVISION
[log in to unmask]
607-721-4565
______________________________ Reply Separator _________________________________
Subject: Paste in hole
Author: [log in to unmask] at CCGATE
Date: 8/16/95 1:27 PM
Hi,
We are interested in assembly alternatives for components requiring wave
soldering. The option of "paste in hole" was suggested. Does anyone have
any experience in using "paste in hole" instead of conventional wave
soldering for assembly of through hole components such as PGAs or
connectors? Any related information, e.g. published papers, reference, or
standards for this manufacturing technique will help. Thanks in advance.
Tom Chung
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