 
| Subject: | |
| From: | [log in to unmask][log in to unmask] Jun 1995 18:57:50 -0600355_- Subject: Time:4:34 PM OFFICE MEMO Source for 'Kapak' Bags Date:6/15/95 We are implementing a low residue process and want to be sure the bags we use do not introduce contamination that will affect our hardware or interfere with conformal coat adhesion. I just reviewed a study in which 'Kapak' bags were used in a similar situation. [...] [log in to unmask] |
| Date: | Thu, 28 Sep 1995 17:27:39 -0500 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
In evaluating temperature profiles for an IR reflow system, I am
looking for the best method of attaching thermocouples to a polyimide
substrate, the board surface finish, and the SMD.
The solder paste has a 280 deg/C (eutectic) reflow temp; therefore the
method used needs to be capable of surviving temps @ or above 350 deg
Celsius.
Any recommendations ???
DJDrake
DRAKE@SSDSRDCC
(713) 987-4365
|
|
|
