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| From [log in to unmask] Sat Apr 27 15: |
14:28 1996 |
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At the ISHM conference in LA, a number of manufacturers supporting the
flip chipp process were exibiting. Bump distribution, sealing the chip
with a vacume (to get sealant "pulled" under the chip) were presented.
At our "Emerging Technologies" meeting, back in 94, a manufacturer who
"bumps" wafers made a presentation.
I am afraid that this info _isn't_ at the local grocery store, but
it is out their.
J. Fjelstad commented:
....It would seem to me that it would be in the best interests of
these folks to fill the airways with information about the nature of their
stucture and its relaibility............
Bill Gaines
===================================================
_ _ _ _ _ International Electronic
| |_ |_| |_ __ | | | Packaging Society
| |_ | _| |_| |_ Orange County Chapter
Voice Mail 714-665-6625
===================================================
International Electronic Packaging Society
voice 708-260-1044 fax 708-260-0867
Information about the IEPS may be obtained via e-mail at
[log in to unmask]
Bill Gaines
AeroJet (for $) IHPVA (for speed & fun)
IEPS (for info) SCCA (for trophys)
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