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I'm searching for information regarding the plating of laser
drilled 6ml vias in multifunctional epoxy on aramid non woven
reinforcement. We have a design of a 6 layer board, .020-.025
overall thickness. Core thickness is .0035, prepreg is .002.
The problem is getting reliable plating into the vias which
go from layers 1 to 3 and 1 to 4. Is there currently proven
technology out there which can reliably perform this
function?
I would appreciate information from Fabricators or OEM's who
are currently working within these areas.
Dan Hickey
Vicor Corporation
508-749-3559
fax 749-3565
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