I'm searching for information regarding the plating of laser drilled 6ml vias in multifunctional epoxy on aramid non woven reinforcement. We have a design of a 6 layer board, .020-.025 overall thickness. Core thickness is .0035, prepreg is .002. The problem is getting reliable plating into the vias which go from layers 1 to 3 and 1 to 4. Is there currently proven technology out there which can reliably perform this function? I would appreciate information from Fabricators or OEM's who are currently working within these areas. Dan Hickey Vicor Corporation 508-749-3559 fax 749-3565