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| From [log in to unmask] Sat Apr 27 14: |
49:06 1996 |
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There are rumors of a study done by HP Fort Collins which showed that
immersion Gold with thicknesses of .000003-5" (three to five millionths) did
not create enbrittlement.
The study assumed the assembly process being used at HP-Fort Collins, which
is no-clean, and their amount of solder paste which they applied. Also, that
thickness of gold over nickel may even be cheaper than HASL tin-lead, but I
don't know.
George Franck
E-Systems, Virginia
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