Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0stbJm-0000HZC; Fri, 15 Sep 95 09:00 CDT |
Old-Return-Path: |
|
Date: |
Thu, 14 Sep 1995 21:10:39 -0400 |
Precedence: |
list |
X-Loop: |
|
Message-ID: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"3-Gm-2.0.-QI.tQOMm"@ipc> |
Subject: |
|
From: |
|
Resent-From: |
|
Resent-Sender: |
|
From [log in to unmask] Sat Apr 27 14: |
49:03 1996 |
Parts/Attachments: |
|
|
Problem:
We experience an unacceptable failure rate with open in rigid flex boards
AFTER assemby and thermal cycling.
Question:
I feel there is a good chance the problem is in the assembly process. What
kind of things should I look for? The boards are mixed surface mount and
thru-hole, with much hand soldering and rework.
Thanks
George Franck
|
|
|