Also please be aware that there is an IPC "Ultra High Density Interconnect"
group formed and working on design and acceptance parameters not yet
included in IPC 2226 or 610.   While this is not strictly on microvias,
that can be one aspect of UHDI constructions.   The committee is designated
as D-33.  Here is the table of contents  proposed new document:

TABLE OF CONTENT

1 Scope. 3 <#_Toc92184067>

2 Terms And Definitions. 3 <#_Toc92184068>

Ultra HDI Definision. 3 <#_Toc92184069>

3 Ultra HDI Design Guide. 4 <#_Toc92184070>

3.1 Conductor and Hole Plating Thickness. 4 <#_Toc92184071>

3.1.1 Background Information. 4 <#_Toc92184072>

3.1.2 Conductor and Hole plating Thickness. 5 <#_Toc92184073>

3.2 Visual Examination. 5 <#_Toc92184074>

3.3 Laminate Imperfections. 5 <#_Toc92184075>

3.4 Laminate Void and Cracks. 5 <#_Toc92184076>

3.5 Annular Rings. 5 <#_Toc92184077>

3.6 Conductor and pad Definition. 5 <#_Toc92184078>

3.7 Nicks and Pinholes in Planes. 5 <#_Toc92184079>

3.8 Copper Plating Adhesion and Peel Strength. 6 <#_Toc92184080>

3.9 Soldermask requirements. 6 <#_Toc92184081>

3.10 Cleanliness. 6 <#_Toc92184082>

4 Qualification, Reliability and Acceptance test 6 <#_Toc92184083>



On Mon, Mar 7, 2022 at 11:31 AM Bush, Jeffrey D. (US) <
[log in to unmask]> wrote:

> IPC-2226 is a good start for designs.  The PCB suppliers will have their
> own DFM guidelines and if you see a large move away from 2226 question
> why.
>
> Jeff
>
> Jeffrey Bush
> Program Quality Engineering Manager
> BAE SYSTEMS
> Electronic Systems Division
> C4ISR Solutions – Space Systems Group
> P.O. Box 868
> Nashua, NH 03061-0868
> T:  +1 603 885 8137  |  M: +1 603 318.8056   |  E:
> [log in to unmask]
> 144 DW Highway, Merrimack, NH 03054  Mail Stop: MER24-116A-A4
>
> Connect with BAE Systems:
>
>
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> please contact the sender and delete all copies.
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Hernandez, Victor G
> Sent: Thursday, March 3, 2022 12:17 PM
> To: [log in to unmask]
> Subject: [TN] Micro Via Technology
>
> External Email Alert
>
> This email has been sent from an account outside of the BAE Systems
> network.
>
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> Fellow TechNetters:
>
>     Is there a doc reference that describes the different types of Micro
> Vias Technology by size/dimensions.
>
> Victor,
>


-- 
Denny Fritz
Consultant
812 584 2687