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| Date: | Tue, 6 Oct 2020 15:41:27 +0000 |
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FEA model should be completed for fatigue to solder joints and devices - ie ceramics
Jeffrey Bush
Program Quality Engineering Manager
BAE SYSTEMS
Electronic Systems Division
C4ISR Solutions – Space Systems Group
P.O. Box 868
Nashua, NH 03061-0868
T: (603) 885-8137 | M: (603) 318.8056 | E: [log in to unmask]
144 DW Highway, Merrimack, NH 03054 Mail Stop: MER24-116A-A4
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-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Jack Olson
Sent: Tuesday, October 6, 2020 11:13 AM
To: [log in to unmask]
Subject: [TN] Bending a Board Assembly
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EXTERNAL EMAIL -- This message originates from outside our organization.
We are considering a change to a manufacturing process which will save time and money, but will cause extra stress on the completed board assembly.
Q1) I'm familiar with bow and twist for bare boards, but is there data on flexing a completed assembly? I'm sure it depends on board thickness and material, etc. but is there danger to the board itself? or does it always break a component first?
Q2) I'm NOT familiar with stress on components. How can I determine whether we are in danger of damaging components, especially SMDs?
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