Dear Colleagues



I am not sure if my last mail to TechNet arrived. Please excuse if I send it a second time.



As already mentioned earlier we need help in reviewing papers for ICEC2020.

Now the first papers arrived and we need reviewers for the following papers:



- The Effect of Relative Humidity on the Diffusion of Brass Elements Through Tin Plating

- SnOx Gradient Composition Inside the Tin-plated Layer

- Alloy Development in the CuNiAl System for High Strength Materials

- Highly durable silver-based physically deposited contact finish for the application in socket connectors

- Investigations on cold welding and galling of various connector platings

- Raman Spectroscopic Analysis of Carbon Film on Frictional Surface of Contact Wire



Could some of you spare time to go through one or two of the papers mentioned above?



Dave already said he could help. But I don`t want to overload him. As I know he already has a lot to do. I guess he is one of the persons who can`t say NO ;-)



Best regards



Günter



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Von: TechNet <[log in to unmask]> Im Auftrag von Bush, Jeffrey D. (US)

Gesendet: Donnerstag, 23. Januar 2020 14:39

An: [log in to unmask]

Betreff: Re: [TN] [External] [TN] FW: IPC-2223D, Sectional Design Standard for Flexible/Rigid-Flexible Printed Board



Given the bonding is robust and the material does not present any assy interference this is a process indicator.



Jeffrey Bush

Program Quality Engineering Manager

BAE SYSTEMS 

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C4ISR Solutions – Space Systems Group

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From: TechNet <[log in to unmask]> On Behalf Of Nigel Burtt

Sent: Thursday, January 23, 2020 7:40 AM

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Subject: Re: [TN] [External] [TN] FW: IPC-2223D, Sectional Design Standard for Flexible/Rigid-Flexible Printed Board



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If I'm understanding the query correctly, having seen something similar recently on a flexi-rigid we found that IPC 6013, section 3.3.1.3 was relevant.



Imperfections in the transition zone rigid to flexi (1.5mm either side of the join) are AABUS or as per purchase documents and not a cause for rejection otherwise.