James,

Thanks for the quick reply.

The components in question are from a single manufacturer and are MSL6 devices. They are properly stored and processed by the CM; have verified the appropriate pre-bake and reflow profile are being used. The majority of the failures we have seen are instant hard failures after bare board assembly but we have seen a few creep through into final assemblies. At this point I believe all components consumed are from a single lot from the manufacturer. I have reached out to the manufacturer in an attempt to determine how they assure component quality prior to shipment but they have not shared any information of value.

Thanks,
Dave