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| Date: | Mon, 6 May 2019 19:30:47 +0000 |
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Why weren't they also caught at PWB End of Line Test, EOL? Perhaps too loose of an audit plan and NOT 100% test.
-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Christopher Brand
Sent: Monday, May 6, 2019 2:22 PM
To: [log in to unmask]
Subject: Re: [TN] Bad Vias - Need help determining the root cause
[EXTERNAL EMAIL]
They were not caught after copper plating and the photos are of the finished assemblies after reflow.
Thank you kindly,
Christopher Brand
Ludlum Measurements, Inc.
501 Oak Street
Sweetwater, TX 79556 USA
(325) 235-5494 Phone, ext:3318
On 5/6/2019 2:19 PM, [log in to unmask] wrote:
> Were this artifact not caught after copper plate AOI????? Air bubbles in platter bath.
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Christopher Brand
> Sent: Monday, May 6, 2019 2:11 PM
> To: [log in to unmask]
> Subject: [TN] Bad Vias - Need help determining the root cause
>
>
> [EXTERNAL EMAIL]
>
> Greetings,
>
> I'm having issues with open vias on a couple of runs of PCBAs and was hoping to get some help on finding a root cause or at least point me in the right direction. I know that there is lots of knowledge and experience on this forum and I'm hoping someone will say they've seen this before, as my knowledge is rather limited on this.
>
> Here are a few photos of the vias in question.
>
> https://ludlums.com/software/BadVias/badvia_01.jpg
> https://ludlums.com/software/BadVias/badvia_02.jpg
> https://ludlums.com/software/BadVias/badvia_03.jpg
> https://ludlums.com/software/BadVias/badvia_04.jpg
> https://ludlums.com/software/BadVias/badvia_05.jpg
> https://ludlums.com/software/BadVias/badvia_06.jpg
> https://ludlums.com/software/BadVias/badvia_07.jpg
> https://ludlums.com/software/BadVias/badvia_08.jpg
> https://ludlums.com/software/BadVias/badvia_09.jpg
> https://ludlums.com/software/BadVias/badvia_10.jpg
> https://ludlums.com/software/BadVias/badvia_11.jpg
> https://ludlums.com/software/BadVias/badvia_12.jpg
>
> On some, the via barrel has a void in the center and on others the edge of the barrel doesn't connect with the pad, Both issues are causing an open via as you can see in the photos.
>
> I know that the board shop recently changed up their plating tanks (new chemical and power supply). Could these bad vias be the result of insufficient current in the plating process or some other process?
>
> I'd be much appreciative of any insight this forum could give.
>
> --
> Thank you kindly,
>
> Christopher Brand
> Ludlum Measurements, Inc.
> 501 Oak Street
> Sweetwater, TX 79556 USA
> (325) 235-5494 Phone, ext:3318
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