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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Wed, 29 Aug 2018 16:29:46 -0400
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text/plain
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text/plain (45 lines)
does ipc-4552A got anything (prf spec fro ENIG  plating) ?
jk
On Aug 29, 2018, at 4:00 PM, SALA GABRIELE wrote:

> Just in advance, it seems IPC-9241 does not mention about Back  
> Plating...
>
> Gabriele
>
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Stadem, Richard D
> Inviato: mercoledì 29 agosto 2018 21:36
> A: [log in to unmask]
> Oggetto: Re: [TN] Thin gold cross section measurement
>
> There is an excellent IPC standard, IPC-9241 Guidelines for  
> Microsection
> Preparation, but I cannot remember if it discusses Back Plating and  
> I do not
> have a copy here in front of me. When I get back Monday I will check.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Wednesday, August 29, 2018 1:53 PM
> To: [log in to unmask]
> Subject: [TN] Thin gold cross section measurement
> Importance: High
>
> Fellow TechNetters:
>
>    Is there an IPC Standard and/or guideline line which stats or  
> recommend
> that if thin gold plating is to be measured by cross section then Back
> Plating Process should be conducted.
>
>
> Victor,
>
>
> ---
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