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August 2018

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Subject:
Re: Thin gold cross section measurement
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Wed, 29 Aug 2018 16:36:50 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines) 
https://electronics.macdermidenthone.com/application/files/ 
4815/0662/8355/ 
Achieving_a_Successful_ENIG_Finished_PCB_Under_REvision_A_of_IPC_4552_Bu 
nce_Martin_SMTA_2017.pdf

On Aug 29, 2018, at 2:53 PM, <[log in to unmask]>  
<[log in to unmask]> wrote:

> Fellow TechNetters:
>
>    Is there an IPC Standard and/or guideline line which stats or  
> recommend that if thin gold plating is to be measured by cross  
> section then Back Plating Process should be conducted.
>
>
> Victor,

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