https://electronics.macdermidenthone.com/application/files/ 
4815/0662/8355/ 
Achieving_a_Successful_ENIG_Finished_PCB_Under_REvision_A_of_IPC_4552_Bu 
nce_Martin_SMTA_2017.pdf

On Aug 29, 2018, at 2:53 PM, <[log in to unmask]>  
<[log in to unmask]> wrote:

> Fellow TechNetters:
>
>    Is there an IPC Standard and/or guideline line which stats or  
> recommend that if thin gold plating is to be measured by cross  
> section then Back Plating Process should be conducted.
>
>
> Victor,