https://electronics.macdermidenthone.com/application/files/ 4815/0662/8355/ Achieving_a_Successful_ENIG_Finished_PCB_Under_REvision_A_of_IPC_4552_Bu nce_Martin_SMTA_2017.pdf On Aug 29, 2018, at 2:53 PM, <[log in to unmask]> <[log in to unmask]> wrote: > Fellow TechNetters: > > Is there an IPC Standard and/or guideline line which stats or > recommend that if thin gold plating is to be measured by cross > section then Back Plating Process should be conducted. > > > Victor,