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Date: | Wed, 18 Jul 2018 17:49:14 +0200 |
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Hello Eray,
According to the policies and procedures document, you have to contact your CIT or MIT.
This would be your first line contact for questions about IPC-A-610!
Regards, Ramon
(Send on The road with iPhone)
> Op 18 jul. 2018 om 17:40 heeft SALA GABRIELE <[log in to unmask]> het volgende geschreven:
>
> Hi Eray,
>
> your interpretation is correct.
>
> Gabriele
>
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Eray CANLI
> Inviato: mercoledì 18 luglio 2018 15:59
> A: [log in to unmask]
> Oggetto: [TN] IPC-A-610 Board-in-Board Class 3 Acceptability
>
> Dear TechNetters,
>
> This is my first post on TN, and it is nice to be part of this list.
>
> I have a confusion on "Supported Holes - Board in Board" part of IPC-A-610 document. How should we interpret the statement "No board in board criteria have been established for Class 3 assemblies". Not sure if IPC forbids board-in-board solder assembly in Class 3.
>
> Should we avoid vertical assembly of boards to each other (without
> connector) in Class 3 designs, or develop our own acceptability criteria?
>
> Thanks in advance!
> Eray CANLI
>
>
> ---
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