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May 2018

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Subject:
Re: Solderjoint elasticity
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Thu, 17 May 2018 12:05:00 -0600
Content-Type:
text/plain
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text/plain (78 lines) 
Hi Robert,

It's when the BGA corners warp upwards during reflow...

Steve

On Thu, May 17, 2018 at 12:00 PM, Robert Kondner <[log in to unmask]>
wrote:

> Hi,
>
>  Silly question: What is a solder "Smile"? Crack?
>
> Thanks,
> Bob K.
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Frank Kimmey
> Sent: Wednesday, May 16, 2018 5:12 PM
> To: [log in to unmask]
> Subject: [TN] Solderjoint elasticity
>
> Can anyone point me in a good direction to learn more about solderjoint
> elasticity with SAC305.
> We are seeing some issues with BGAs when they smile.
> Type 2 fractures and the vendor recommends increasing the solderpaste.
> This seems counter intuitive to me.
> If it was SnPb I would go back and hunt some of Werner's research.
> As it is Lead free I need some direction.
> Any help is appreciated,
> FNK
>
> Frank N Kimmey CID+
> Electrical Engineer/PCB Design
>
> Verifone
> 1400 W Stanford Ranch Road
> Rocklin, CA 95765
> T: 916-625-1818
> M: 916-833-9877
>
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-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

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