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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Tue, 29 Aug 2017 16:31:07 -0400
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text/plain (50 lines)
adhesion not adhesive... correction...
On Aug 29, 2017, at 4:29 PM, Yuan-chia Joyce Koo wrote:

> aluminum wire bond?  usually no problem on quartz, unless you  
> directly bond  on top of the structure (MEMS for example).  As for  
> gold plating lift off, either you have over travel of bond head  
> (wedge), smash (force) too much, or your gold seed layer adhesive  
> not strong enough (chemical seeding, instead of good   
> sputtering)... IMHO (old info... more than 10 year old.. for your  
> reference only).
> jk
> On Aug 29, 2017, at 1:49 PM, Ioan Tempea wrote:
>
>> Dear Technos,
>>
>> Does any of you have experience with wire bonding on quartz  
>> components?
>>
>> Can ultrasonic bonding damage quartz or can it lift the Au plating  
>> from the quartz base material?
>>
>> Any process related suggestions?
>>
>> Thank you,
>>
>> Ioan Tempea, P. Eng.
>> Senior Manufacturing Engineer, Satellite Systems
>>
>> [cid:[log in to unmask]]
>>
>> MacDonald, Dettwiler and Associates Corporation, 21025 Trans- 
>> Canada Highway, Ste-Anne-de-Bellevue, QC, Canada H9X 3R2
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>>
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