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August 2017

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Tue, 29 Aug 2017 16:29:12 -0400
Content-Type:
text/plain
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text/plain (46 lines)
aluminum wire bond?  usually no problem on quartz, unless you  
directly bond  on top of the structure (MEMS for example).  As for  
gold plating lift off, either you have over travel of bond head  
(wedge), smash (force) too much, or your gold seed layer adhesive not  
strong enough (chemical seeding, instead of good  sputtering)... IMHO  
(old info... more than 10 year old.. for your reference only).
jk
On Aug 29, 2017, at 1:49 PM, Ioan Tempea wrote:

> Dear Technos,
>
> Does any of you have experience with wire bonding on quartz  
> components?
>
> Can ultrasonic bonding damage quartz or can it lift the Au plating  
> from the quartz base material?
>
> Any process related suggestions?
>
> Thank you,
>
> Ioan Tempea, P. Eng.
> Senior Manufacturing Engineer, Satellite Systems
>
> [cid:[log in to unmask]]
>
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> Highway, Ste-Anne-de-Bellevue, QC, Canada H9X 3R2
> Tel: +1-514-457-2150 x3556
> www.mdacorporation.com<http://www.mdacorporation.com/>
>
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