Hello Arnaud -  as a general rule, having a lead-free component finish in a
tin/lead soldering process is not a big deal. Technically, the industry has
been doing that for years with the use of gold or Pd/Ag surface finishes on
components. The critical variable is "who" is contributing the most solder
volume to the solder joint formation. Soldering a PTH connector shouldn't
be a issue as the primary solder volume contribution is coming from the
soldering process and not the component surface finish.However, area array
components such as BGAs or CSPs are the other side of the coin as the
solder sphere is the primary solder volume contributor thus the reason many
assemblers take mitigation steps such are reballing to avoid solder joint
integrity issues. I would not expect you to have an issues with your
connector solder joint integrity based on the details you listed.

Dave Hillman
Rockwell Collins
[log in to unmask]


On Thu, Mar 23, 2017 at 4:01 AM, GRIVON Arnaud <
[log in to unmask]> wrote:

> Dear TechNetters,
>
> I have a coming situation where one PTH connector will be degolded and
> reterminated using a SAC305 solder dipping process.
> Should I expect wetting/soldering concerns assuming a Tin-Lead soldering
> process such as wave or selective wave?
>
> I have no experience or knowledge of such configuration and am wondering
> about possible issues due to short contact times between the SAC305 pin
> finish and the Tin-Lead solder.
> Thanks in advance for your inputs.
> Best regards,
>
> Arnaud Grivon
> PCB/PCBA Technology Expert
> "Un expert, c'est un homme qui connaît de plus en plus sur de moins en
> moins de choses"
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