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January 2017

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Subject:
Re: Plugging Thermal Via Holes with Soldermask?
From:
"Peter G. Houwen" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 31 Jan 2017 08:21:48 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (14 lines) 
That cost difference does sound pretty high.  But if it's prototype quantities and delivery, it's not out of line.  Especially if it's a shop that doesn't do plugging and has to send it down the street to another shop.  The cost delta should be less in production.

You can even recover some of that cost by filling more vias.  Once you filled some vias, it costs no more to fill more.  so any vias that might be at risk of causing manufacturing difficulty - fill 'em.  Take advantage of the space savings of via in pad.  Fill everything under chip scale packages.  That little increase in yield could pay for the filled vias.

Pete

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