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November 2015

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Subject:
From:
Sandy Gentry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Sandy Gentry <[log in to unmask]>
Date:
Wed, 18 Nov 2015 06:25:32 -0600
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Show a technical poster at the industry's premier conference on electronics manufacturing and gain significant visibility 
for you and your company on your research and knowledge. Thousands of individuals will attend IPC APEX EXPO, ensuring 
that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide.

Posters will be displayed throughout the event, with poster presentations scheduled for Wednesday, March 16 at 10 am and 
4:30 pm, offering additional visibility.

Poster Topics
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes, 
and equipment, especially: 

-Automation in Electronics Manufacturing
-Adhesives
-Advanced Technology
-Area Array/Flip Chip/0201 Metric
-Assembly and Rework Processes
-BGA/CSP Packaging
-Black Pad and Other Board Related Defect Issues
-BTC/QFN/LGA Components
-Business & Supply Chain Issues
-Cleaning
-Conformal Coatings
-Corrosion
-Counterfeit Electronics
-Design
-Electromigration
-Electronics Manufacturing Services
-Embedded Passive & Active Devices
-Environmental Compliance
-Lean Six Sigma
-LED Manufacturing
-Failure Analysis
-Flexible Circuitry
-HDI Technologies
-Head-on-Pillow
-Board and Component Warpage
-High Speed, High Frequency & Signal Integrity
-Lead-Free Fabrication, Assembly & Reliability
-Miniaturization 
-Nanotechnology 
-Optoelectronics
-Packaging & Components
-PCB Fabrication
-PCB and Component Storage & Handling Performance
-Quality & Reliability
-Photovoltaics
-PoP (Package-on-Package)
-Printed Electronics
-Reshoring
-RFID Circuitry
-Robotics
-Soldering
-Surface Finishes
-Test, Inspection & AOI
-Tin Whiskers
-2.5-D/3-D Component Packaging
-Underfills
-Via Plugging & Other Protection
-Wearables


For more information[http://www.ipcapexexpo.org/html/present/call-for-participation.htm] about conference participation, please  contact Conference Director Jasbir Bath[mailto:[log in to unmask]], or, IPC technical  conference director or Toya Richardson[mailto:[log in to unmask]], IPC Technical Programs  Coordinator at +1 847-597-2823.

Requirements for Submission
Provide an abstract of up to 300 words that summarizes  technical and previously unpublished work covering case histories, research and discoveries.

Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, March 16, 2016.

www.IPCAPEXEXPO.org[http://www.ipc.org/ipcapexexpo.org]

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