That would be in the component drawing from the vendor.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, November 09, 2015 12:51 PM
To: [log in to unmask]
Subject: [TN] IPC SMT Lead to package co-planarity

Fellow TechNetters:

   In which IPC STD will I find information of distance between the plastic housing standoff and lead height.   INMHO the standoff should rest on the solder mask surface while the lead should have a slight gap to rest on the PWB copper pads.   I hope that this makes sense.   A print/spec is not readily available.

Victor,


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